Airsys Redefines High-Density Cooling with New UniCool-Max Precision Vertical Packaged Unit

International Data Center Day

Redefining AI Infrastructure for International Data Center Day

March 23, 2026

Airsys Introduces Next-Generation LiquidRack™ Technology to Provide a Simpler Liquid Cooling Architecture for Retrofit, Edge, and Mid-Density AI Infrastructure

April 20, 2026