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LONDON, UK – Airsys, a global leader in engineered thermal solutions for AI and mission-critical environments, will demonstrate its integrated liquid and air-cooling platforms designed to support the next generation of high-density AI infrastructure at Data Centre World London (4-5 March 2026). Located at Stand F150, Airsys will unveil its latest liquid and air-cooling innovations designed specifically for the AI era, while senior leadership will join industry experts to discuss the shift toward “regenerative” data centre infrastructure.
As AI workloads push power densities to unprecedented levels, traditional cooling methods are reaching their limits. At this year’s event, Airsys will showcase its comprehensive PowerOne™ ecosystem — a scalable foundation for hyperscale, colocation, and edge environments.
Innovations on Display (Stand F150)
Visitors to the Airsys stand will experience a range of industry-forward technologies, including:
- LiquidRack™: A patented single-phase spray liquid cooling solution built for high-density AI deployments. By increasing heat transfer efficiency while minimizing dielectric fluid usage, LiquidRack enables closed-loop, compressorless operation with server-level spray cooling. Operating at elevated liquid temperatures without compromising CPU junction temperatures, it supports year-round free cooling, eliminating mechanical chilling and maximizing energy efficiency.
- FluidCool-X™ CDU: An intelligent Coolant Distribution Unit purpose-built for AI infrastructure, featuring ultra-tight approach temperatures for maximum energy recovery. FluidCool-X CDU’s cutting-edge technology allows operators to scale cooling quickly, maintain uptime, and stay ahead of rising thermal loads.
- UniCool™: The Unicool is packaged system combining fresh air free cooling with variable speed DX technology. Designed for Edge and Telecoms applications and able to withstand harsh environments, UniCool provides free cooling at low ambient conditions to deliver an energy-efficient, low OPEX cooling solution.
- UniCool-Edge™: High-efficiency air-cooling solutions designed for modularity and rapid deployment. The UniCool-Edge is a pioneering horizontal packaged system designed for edge computing applications. Through seamless integration with hot- and cold-aisle configuration, the UniCool-Edge manages airflow distribution to enhance system efficiency. UniCool-Edge’s variable-speed technology and integrated free-cooling combine to deliver a cutting-edge cooling solution.
- Turboplate with Microchannel Blending Technology (MBT): Advanced, additively manufactured cold plates engineered for next-generation AI accelerators and high-density compute platforms. Featuring a monolithic microchannel architecture with optimized two- phase distribution, TurboPlate delivers ultra-high heat flux removal across GPU, CPU, HBM, and VRM components within an integrated module.
Expert Insights and Speaking Engagements
Airsys leadership will participate in three high-impact sessions addressing sustainability, AI resilience, and the future of design:
- Stay Sustainable in the Age of AI
- Date/Time: 4 March, 1–1:30 p.m.
- Theatre: Operational Transformation & Resilience
- Speaker: Paul Quigley, Chief Strategic Relations Officer, Airsys
- Panelists: Joined by experts from Techbuyer, Pulsant, and RISE Research Institutes of Sweden.
- The Journey of Fire: How Power Becomes Compute — and Where It Breaks
- Date/Time: 4 March, 2:35 – 3 p.m.
- Theatre: Design and Build & Physical Security
- Speaker: Paul Quigley, Chief Strategic Relations Officer, Airsys
- Regenerative Infrastructure: The Future of Sustainable Data Centres
- Date/Time: 5 March, 1–1:25 p.m.
- Theatre: Design and Build & Physical Security
- Speaker: Tony Fischels, Vice President-PowerOne, Airsys
- Panelists: Joined by Mark Acton (DCA) and Brian Condon
“The conversation has shifted from simply surviving the AI surge to thriving through intelligent, regenerative design,” said Paul Quigley, Chief Strategic Relations Officer at Airsys. “At Data Centre World, we are showing the industry that they don’t have to choose between performance and planet.”
About Airsys
Airsys is a global leader in engineered thermal solutions for mission-critical cooling, combining 30+ years of technical excellence with a purpose-driven focus on efficiency and sustainability. We deliver high-performance cooling solutions that power the world’s most demanding digital infrastructure, including AI, cloud, edge computing, telecom, medical imaging, and advanced manufacturing environments.
By enabling higher Power Compute Effectiveness (PCE), Airsys helps customers convert more power into performance. The company is headquartered in South Carolina, USA, and supports its global mission with 1,000+ employees across 16 global locations. For more information, visit www.air-sys.uk
Media Contact:
Madelyn Haycock
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